Method and system for improved semiconductor processing equipment vibration isolation and reduction

ABSTRACT

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam. In addition, utilization of this method for dedicated MEP (mechanical, electrical, plumbing) support pedestal, only attach as support for MEP lines, as to improve isolation of low frequency vibration.

FIELD OF THE INVENTION

The present disclosure relates to semiconductor and similar high precision processing facilities and, more particularly to a method and system for improving vibration parameters associated with semiconductor equipment operations and the like, additionally the present disclosure provides a method and system for improved semiconductor processing equipment vibration isolation and reduction by transforming vibration conducting properties of fabrication equipment as installed within a fabrication facility.

BACKGROUND OF THE INVENTION

Generally, the present disclosure relates to isolation of vibration frequency for Semiconductor tool pedestal/pad and raised floor system. The following description is intended to the reader various aspects of this application. With background information to better understand the various aspect of present disclosure. It should be understood that these statements are to be read in this light, and not as admissions of prior art.

As semiconductor chips are advancing to smaller nanometer size, the need for isolation of unwanted vibration frequency now takes a central position in fabrication facility design and operation. Low frequency vibration may affect production tools such as lithograph tools and, thereby, lower production yield rate in semiconductor fabrication. Foot traffic over raised floor systems, oscillating pumps, compressors, chillers and AHUs (air handling units) produce low vibration frequencies transmitted though building and clean room floor structure. Contributing to unwanted vibration frequencies, many lines and pipes from pumps, compressors, chiller attach to pedestal under these tools without vibration isolation support mounts. Due to cost and installation time, only critical semiconductor production tools are equipped with vibration controlled and/or active isolation or vibration dampening tool pedestals and pads; most tools relied on it's built in passive vibration isolation systems for vibration control.

Most semiconductor fabrication facilities are routinely remodeled, modified, repurposed multiple times to accommodate new technology due to enormous building cost and prolonged build time. Majority of the Semiconductor facilities are remodeled facilities and are designed for previous equipment and vibration requirements, which were built 5, 10, 15 plus years ago.

New semiconductor tools have larger tool footprint, additional increase MEP lines accessed from below the tooling. To accommodate new semiconductor tools, height of raised floor system for the Process level or area has been increased; which many steel and aluminum members also increased in size and diameter. In many instances, areas, which were not design with “waffle floors”, are raised even higher with elevated floor systems meet cleanroom downdraft air movement specification. As floor or tool pedestal are raised higher, many hollow steel or aluminum member are used keep the weight and cost to minimum.

Many semiconductor production support tools are capable of working and supporting new critical dimension production tools, such as lithography tools with or without modifications. New production tools have tighter vibration frequency requirements, which are equipped with designed specific vibration isolated tool pedestal and pads. However, new critical tools are usually operating in conjunction with older support tools with outdated vibration specifications. In many occasions, older tools only rely on its built-in passive vibration isolation systems, for vibration control. Economically, replacing all support tools with matching vibration specification for new key production tools is not feasible.

Improvement for isolation of vibration frequency transmitted though building structure is needed for better production yield rate. It must be economical, schedule driven and with minimal weight for ease of material handling and installation.

In light of the above, a further need exists for providing a method and system for improved semiconductor processing equipment vibration isolation and reduction.

There is the need for a method and system for eliminating or substantially reducing low frequency vibrations which affect production tools such as lithograph tools by lowering production yield rate in semiconductor fabrication.

There is a further need for a method and system for reducing or preventing the effects of vibration sources, such as foot traffic over raised floor system, pumps, compressors, chillers and AHUs (air handling units) that produce low vibration frequencies transmitted though building and clean room floor structures.

A need exists for a method and system to allow semiconductor production tools having tighter vibration frequency requirements to operate effectively in conjunction with older support tools with outdated vibration specifications.

Finally, a need exists for the ability to avoid the enormous expense of replacing all old support tools with new ones having vibration specification matching new key production tools. That is, there is the need to eliminate or substantially reduce the considerations of vibration and noise control in equipment operation from decisions of how and when to replace older equipment.

BRIEF SUMMARY OF THE INVENTION

The disclosed subject matter provides for improved vibration control and protection for semiconductor fabrication equipment, additionally the present disclosure provides a method and system for improved semiconductor processing equipment vibration isolation and reduction using an integrated system for eliminating vibration conduction paths throughout a fabrication facility.

In light of the above, the present disclosure provides a method to improve vibration isolation in semiconductor process facilities. The present method and system essential eliminates vibration frequencies transmitted though a building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads, within semiconductor. The method and system use sound proofing material and/or foam into fill or partially fill hollow steel and aluminum support members and sound proofing adhesives and caulks at point of connections in conjunction with mechanical fastening. In various applications, the present disclosure includes placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material or foam.

In summary, the present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure. The method comprises the steps of separating a base of the elevated structure from the floor using a first vibration isolation pad structure. A vibration absorbing foam fills a hollow portion of a vertical support structure separating the base from said upper surface. A second vibration isolation pad structure separates the vertical support structure from the upper structure of the elevated structure. In the present disclosure, the first vibration isolation pad structure, the vibration absorbing foam, and the second isolation pad structure coordinate to eliminate or substantially reduce the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure.

According to present teaching the disclosure includes a method, system, and semiconductor fabrication facility for eliminating or substantially reducing process-limiting vibrations within a high-precision device manufacturing facility. In such a disclosure an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure. Here, the teachings involve separating a base of the elevated structure from the floor using a first vibration isolation pad structure. In addition, the present disclosure includes filling a hollow portion of a vertical support structure with a vibration absorbing foam, the vertical support structure separating the base from the upper surface. The disclosure includes separating the vertical support structure from the upper structure of the elevated structure using a second vibration isolation pad structure. Accordingly, the coordination of the first vibration isolation pad structure, the vibration absorbing foam, and the second isolation pad structure coordinate to eliminate or substantially reduce the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of the elevated structure.

Application of the disclosed method and system improves isolation of vibration frequencies transmitted though building structures from tools in operation in process level (older support tools work with new key production tools) to pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads.

The disclosed method and system include the use of dedicated MEP (mechanical, electrical, plumbing) support pedestals, only attach as support for MEP lines, as to improve isolation of low frequency vibration. With minimal weight increased for material for ease of material handling and installation, this method is intended for tools without specifically vibration frequency dampened and isolation designed tool pedestals and pads; which only relied on it's built in passive vibration isolation systems.

A technical advantage of the present disclosure includes reduction and isolation of vibration frequencies for improving production yields as semiconductor chip design is advancing in smaller nanometer critical dimensions for semiconductor device processing.

Another technical advantage of the present disclosure includes the ability to use the disclosed vibration isolation structures in addition to industry standard structures such as construction isolation joints, miniature damping pads between raised floor tiles to pedestal, and vibration isolation connectors for MEP lines.

A further technical advantage of the present disclosure includes the improved isolation of vibration frequencies transmitted though building structure to achieve better production yield rates. The method and system of the present disclosure are economical, schedule driven and impose minimal weight in the construction of material handling and installation facilities for nanometer-scale semiconductor fabrication facilities and similar high precision lithography and fabrication environments. As a result of the present teachings, semiconductor fabrication yields and process efficiencies greatly improve.

Yet a further beneficial aspect of the present disclosure is a method and system for eliminating or substantially reducing low frequency vibrations which affect production tools such as lithograph tools, so as to increase lithographic accuracy and yield percentages in semiconductor device fabrication.

Yet another technical advantage of the present disclosure includes the reduction of effects from vibration sources, such as foot traffic over raised floor system, pumps, compressors, chillers and AHUs (air handling units) that produce low vibration frequencies transmitted though building and clean room floor structures.

Yet a further technical advantage of the present disclosure includes the ability to allow newer semiconductor production tools having tighter vibration frequency requirements to operate effectively in conjunction with older support tools with outdated vibration specifications. The ability to extend older equipment useful live may result in process expense reductions and greater operational profits for semiconductor device fabrication facilities.

Technical advantages of the present disclosure include providing a hybrid system for eliminating/substantially reducing both high frequency vibrations and low frequency vibrations. High frequency vibrations may be considered, for example, Workshop (ISO), Office (ISO), Residential Day (ISO), and Operating Theatre (ISO) ranges of vibration, as defined here by the chart of FIG. 16. Low frequency vibrations may be considered those vibrations classified as VC-C, VC-D, and VC-E in FIG. 16. The teachings of the present disclosure provide the ability to establish an environment operating in the range of VC-E.

Another technical advantage of the present disclosure includes providing an active foam system using composite foam structures for vibration isolation. This design permits vibration isolation without having to modify entire structures, as well as with minimal overall weight variations as a result of vibration isolation modifications. The teachings of the present disclosure permit installation of composite foam within structural components rapidly and as little as one-day disruption in fabrication facility operations. As a result, the significant improvements of the present subject matter afford major operational and efficiency improvements with a most economical set of structural transformations to increase overall fabrication facility profitability and efficiency.

Finally, the present method and system provide the ability to avoid the enormous expense of replacing all old support tools with new ones having vibration specification matching new key production tools. In effect, the present disclosure enables the elimination or substantial reduction of many considerations of vibration and noise control in equipment operation.

BRIEF DESCRIPTION OF THE DRAWINGS

The present subject matter will now be described in detail with reference to the drawings, which are provided as illustrative examples of the subject matter so as to enable those skilled in the art to practice the subject matter. Notably, the FIGUREs and examples are not meant to limit the scope of the present subject matter to a single embodiment, but other embodiments are possible by way of interchange of some or all of the described or illustrated elements and, further, wherein:

FIG. 1 shows a metal tool pedestal and pad with adjustable height hollow steel member pedestal configured consistent with the teachings of the present disclosure;

FIG. 2 depicts a concrete type tool pedestal supported with structural steel configured consistent with the teachings of the present disclosure;

FIG. 3 exhibits a hollow horizontal structural member configured consistent with the teachings of the present disclosure;

FIG. 4 presents a raised floor system on an adjustable hollow steel pedestal configured consistent with the teachings of the present disclosure;

FIG. 5 shows a pedestal dedicated for MEP (mechanical, electrical, plumbing) line support configured consistent with the teachings of the present disclosure;

FIG. 6 presents a concrete type tool pedestal and pad configured consistent with the teachings of the present disclosure;

FIG. 7 depicts a metal type tool pedestal and pad configured consistent with the teachings of the present disclosure;

FIG. 8 displays square hollow member configured consistent with the teachings of the present disclosure;

FIG. 9 shows part of a tile assembly for limiting vibration transmission throughout the semiconductor equipment platform structure; and

FIG. 10 depicts further aspects of a tile assembly for limiting vibration transmission throughout the base of a semiconductor equipment platform structure.

FIG. 11 provides a 3D view of a concrete tool pedestal employing teachings of the present disclosure;

FIG. 12 shows a concrete and porous high strength metal combined to make hybrid tool pedestal/pad exhibiting teachings of the present disclosure;

FIG. 13 is 3-D view of a concrete encased in metal type tool pedestal/pad with multiple perforated spacers according to teachings of the present disclosure;

FIG. 14 shows a 3-D view of a high strength porous metal structure with voided spaces according aspects of the present disclosure;

FIG. 15 provides a 3-D view of multiple layers of perforated high strength porous metal according to the present disclosure; and

FIG. 16 presents a table plotting vibration velocity levels against one-third octave band frequencies to show various equipment vibration standard for the subject matter other present disclosure.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The detailed description set forth below in connection with the appended drawings is intended as a description of exemplary embodiments in which the presently disclosed process can be practiced. The term “exemplary” used throughout this description means “serving as an example, instance, or illustration,” and should not necessarily be construed as preferred or advantageous over other embodiments. The detailed description includes specific details for providing a thorough understanding of the presently disclosed method and system. However, it will be apparent to those skilled in the art that the presently disclosed process may be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the presently disclosed method and system.

In the present specification, an embodiment showing a singular component should not be considered limiting. Rather, the subject matter preferably encompasses other embodiments including a plurality of the same component, and vice-versa, unless explicitly stated otherwise herein. Moreover, applicants do not intend for any term in the specification or claims to be ascribed an uncommon or special meaning unless explicitly set forth as such. Further, the present subject matter encompasses present and future known equivalents to the known components referred to herein by way of illustration.

The present disclosure shows a method to improve vibration isolation in semiconductor process level. Vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals/pads, within semiconductor are eliminated or substantially reduced. The present method and system use sound proofing material and foam into hollow steel or aluminum support members and sound proofing adhesives and/or caulking at point of joint connections in conjunction with mechanical fastening. In various applications, the present disclosure includes the placement of shaped wielded rod for dissipating vibration energy in center of hollow members, such as vertical posts or pedestals, which are surrounded with sound proofing material or foam.

In addition, utilization of this method may be for dedicated MEP (mechanical, electrical, plumbing) support pedestal, only attach as support for MEP lines, as to improve isolation of low frequency vibration. As semiconductor chip design is advancing in smaller nanometer critical semiconductor device dimensions, reduction and isolation of vibration frequency is needed for improving production yield.

The subject matter of the present disclosure eliminates or substantially reduces shorts in sound transmission by creating barriers and spaced openings from ground or base level through the support vertical components to the equipment platforms they're above. In the support vertical components appear sound isolation foam, pads between metal structures and physical structures for receipt and transmission of vibrations at low-frequency that can adversely affect the operation of nanoscale semiconductor fabrication equipment.

With no equipment, there may be rubber pads and other pads to isolate metal from metal. However, overtime such structures as rubber pads can become densified or brittle. In either case a sound short may arise between the metals and transmitted through the densified or brittle rubber or other material that otherwise would be used. This would cause unwanted vibration transmission.

In the present disclosure, as opposed to rubber pads, sound isolation caulking may be placed between the metal structures. Sound isolation caulking has properties of avoiding densification or brittlelization. As a result, sound and vibration are isolated at the low frequencies. With rubber pads and the like, there may be small voids that arise between the rubber pad on the metal surfaces. Instead of using such pads, or isolation structures, the use of sound isolation caulking allows for variations in dimensions and surface anomalies and yet provides sound isolation for structures that is continuous to fully prevent vibration transmission across the metal components.

By employing sound dampening between the metal structures, or, perhaps, and adhesive, the disclosure shows that vibration may not pass from one metal structure to another.

FIG. 1 is example of metal tool pedestal pad with adjustable height hollow steel member pedestal. With reference to FIG. 1, there appears metal tool pedestal 10 on floor 12 upon which adjustable hollow steel number 14 rests, with bolts 16 through base 18, and screw or otherwise fasten into floor 12. Adjustable height hollow steel member pedestal 14 includes vertical adjustment mechanism 20. Connecting at the top of vertical adjustment mechanism 20 appears bolt mechanism 22 having bolted there within I-beam 24. I-beam 24 bolts to metal tool pedestal base 26.

Metal tool pedestal 10 further includes soundproofing adhesive 28 positioned between I-beam 24 and pedestal base 26. Within hollow portion 30 of adjustable height hollow steel member 14 appears sound insulating foam 32. Between base 18 and floor 12, the present disclosure includes soundproofing adhesive 34. Instead of sound proofing adhesive 34, a sound proofing vibration proofing caulking may be used.

FIG. 2 is example of concrete type tool pedestal supported with structural steel. With reference to FIG. 2, concrete type tool pedestal 40 includes structural steel beams 42 supported by base members 44. Structural beams 42 include upper joint 46 in a “T” shape and supporting pedestal base 48. Between pedestal base 48 in upper joint 46 appear metal spacers 50. Ties 52 provide further association between pedestal base 48 and upper joint 46. Spacers 50 connect between pedestal base 48 and bottom surface 54 and may be formed of a variety of materials to achieve vibration separation.

Adhesive soundproofing or vibration isolation caulking 56 serves as a vibration barrier between T portion 46 and bottom surface 54. Similarly, vibration isolation adhesive or caulking 58 separates base member 44 and floor 12.

FIG. 3 is example of hollow vertical structural member filled with sound proofing material or foam for a raised floor system. With reference to FIG. 3, hollow vertical structural member 60 may be filled with soundproofing material 62, which may be also a foam. Hollow vertical structural number 60 may be used for a raised floor system 64 and a metal pedestal.

Connecting from hollow vertical structural number 62 appears vertical tie 66 into hollow vertical support element 68. Hollow vertical support element 68 upper portion 70 may be filled with soundproofing material or vibration isolation material 72. In addition, adhesive pad or caulking separator 74 separates hollow vertical support element 68 from raised floor system 64. Likewise, soundproofing adhesive or vibration isolation caulking 76 separates base 78 of hollow vertical support member 60 from floor 12.

FIG. 4 is an example of raised floor system on an adjustable hollow steel pedestal. With reference to FIG. 4, vibration isolation platform 80 includes an example of a raised floor system 82 supported by an adjustable hollow steel pedestal 60 to create a vibration isolation platform. As illustrated above, sound isolation phone 84 may be used to fill adjustable hollow steel pedestal 60 with at adhesive pad or vibration isolation caulking 86 separating adjustable hollow still pedestal 60 from floor 12.

FIG. 4 illustrates a type of structure which may be a metal support I-beam going across a vibration isolation platform. At the point of contact there is vibration isolation. Sound isolation caulking may be placed at the top of the platform beneath the platform stanchion, and along the vertical wall of the stanchion. Discontinuing use of sound isolation caulking provides a total reduction of vibration from the floor that may be receiving equipment vibrations through and prevents transmission of such vibrations up the vertical supports and then further provides a barrier as any further vibration may pass from the vertical support to the upper horizontal platform surface.

FIG. 5 is example of pedestal dedicated for MEP (mechanical, electrical, plumbing) line support. With reference to FIG. 5, pedestal configuration 94 passing mechanical, electrical, plumbing (MEP) line support while maintaining are improving sound or vibration isolation within the fabrication equipment setting. Pedestal 92 passes or allows the passage of mechanical line 94, Electrical line 96, and plumbing line 98. Base 100 supports pedestal 92 with adhesive or Caulking 102 separating bass 100, and therefore pedestal 92, from vibrations that may exist from floor 12.

FIG. 5 shows imposition of MEP lines in pedestal configuration 94 structure and how such might be vibration isolated for the purpose of the present disclosure. With MEP lines on the top of the support structure for such an equipment, there is frequently The attachment of the equipment to the vertical support structures. Such attachment ultimately results and a sound transmission path from the vertical stanchion or support to the supported equipment on the horizontal platform.

FIG. 6 is example of concrete type tool pedestal/pad supported with hollow structural steel/aluminum filled with sound proofing material/foam and sound proofing adhesive/caulking at point of connections. With reference to FIG. 6, concrete type tool pedestal 110 is supported with hollow structural steel/aluminum Field support 112 providing such structural support for concrete beam 114. Ties 116 on concrete beam 114 in position relative to hollow structural steel/aluminum supports 112. Between concrete type being 114 and follow structural steel/aluminum supports 112, appears adhesive pad or vibration isolation caulking 118.

Note that hollow structural steel/aluminum filled supports 112 may also receive soundproofing adhesive or vibration isolation 124. In addition, adhesive pad 122 may likewise be of use in separating vibration from floor 12 to hollow structural steel/aluminum filled supports 112.

FIG. 7 is example of metal type tool pedestal/pad supported with hollow structural steel/aluminum filled with sound proofing material/foam and sound proofing adhesive or caulking at point of connections. With reference to FIG. 7, metal type tool pedestal/pad 130 supported by hollow structural steel/aluminum filled supports 132. How structural steel or aluminum supports 132 may be filled with sound isolation or vibration isolation foam 134. Between hollow structural steel/aluminum filter supports 132 and floor 12 also appear adhesive pads or vibration isolation caulking 136.

FIG. 8 is example of square hollow member with a vibration energy dissipating rod surrounded in sound proofing material or foam and sound proofing adhesive/caulking at point of connections. With reference to FIG. 8, square hollow member 140 further includes vibration energy dissipating rod 142 that attaches to base 144. From base 144 through vibration energy dissipating rod 142 energy that may be sensed from floor 12 may be directed into sound isolation or vibration isolation phone 146. In addition, square member 140 may include an inner sound dampening pad or vibration isolation caulking 146 that may isolate vibration from the exterior surface of square hollow number 40 into sound dampening or vibration isolation foam 146. Thus, square member 140 architecture of FIG. 8 illustrate some sound barriers or vibration barriers that essentially eliminate or substantially reduce any vibration from floor 12 to upper pedestal layer 150.

The vibration isolation system aims for creating a barrier by absorbing part of the external vibration transmitted through the concrete/steel interface and confine it within the steel tube capsule by means of several energy absorbers. The energy dissipation mechanism constitutes a steel tube itself with rubber coating on the internal surface, energy dissipation rod mechanism with rubber coating on the external surface, and composite foam fill in between rod and tube wall. It is foreseen that the energy absorption rod may exhibit piston-type behavior due to presence of the composite foam fill. The type of vibration expected and range of frequencies needing suppression would determine the design properties of the components in the energy absorption mechanism. This includes sizing of the steel tube, top and bottom cap plates, geometry of the rod, and densities of the foam and rubber.

FIGS. 9 and 10 show part of a tile assembly for limiting vibration transmission throughout the semiconductor equipment platform structure. With reference to FIG. 9, tile set 160 includes first tile 162 and second tile 164. First tile 162 includes a screen or Mesh configuration for use on surfaces associated with a semiconductor equipment platform structure such as exhibited above FIGS. 1 through 8.

Note that the configuration of tiles 162 in tile 164 is such that the spacing between openings entire 162 are smaller than the openings in tile 164. This has a vibration canceling a fact in the sense that eliminates are substantially reduces sinusoidal vibration transmissions.

FIG. 10 depicts further aspects of a tile assembly for limiting vibration transmission throughout the base of a semiconductor equipment platform structure. With reference to FIG. 10, tile configuration 170 includes upper tile 172, which has different opening and spacing dimensions from lower tile 174. As such tiles are assembled the transmission of noise along or into a vibration dissipating platform I substantially improve.

Considering both tile assembly 160 of FIG. 9 and tile assembly 170 of FIG. 10 and with reference to FIG. 8, notice that sound isolation pad 146 rest beneath base 144 of the structural member 140. This association of two separate tiles to mitigate vibration transfer from floor 12 to structural member of 140 has proven to be markedly effective in reducing her substantially eliminating transmission of vibration into hollow support member 134.

FIG. 11 shows a 3D view and example of concrete tool pedestal 188 next to metal type tool pedestal/pad 190, multiple perforated spacers 184 forming layered dampeners with sound proofing/dampening adhesive/caulk in the voided spaces and simple hybrid dampener of perforated spacer 186 with sound proofing/dampening adhesive/caulk at point of contact (hybrid dampener), set in clean room with waffle floor.

FIG. 12 provides a view of concrete 208 and porous high strength metal 210 combined to make hybrid tool pedestal/pad 203 serving as a layered hybrid dampener, including multiple perforated spacers with sound proofing/dampening adhesive/caulk and 206 serving as a simple hybrid dampener perforated spacer with sound proofing/dampening adhesive/caulk at point of contact serving as a hybrid dampener, set in clean room with waffle floor. Hybrid tool pedestal/pad, consist of concrete and high strength porous metal with hybrid composite dampener.

With the present discloser there may be different configurations for placement/position of vibration isolation mater, to include all sides, for concrete, porous high strength metal, type of steel layer and hybrid dampening spacer, may be placed in different sequence of layers. Such examples may address the need for a low center of gravity, high porous high strength metal may be on top of concrete to include type of steel added to the bottom for added weight. According to the type of production equipment, contact surface, or location of equipment need within the production area may dictate the position and location of concrete, porous high strength metal, steel plating and hybrid dampening spacer in different sequence and positions.

Using a porous metal with high strength provides excellent vibration reduction performance. Aluminum and its alloys offer a wide range of properties that can be engineered precisely to the demands of specific applications, such as in aerospace, advanced nuclear reactors, surface coating and metal/air batteries, through the choice of alloy, temper condition and fabrication process. By utilizing various combinations of its advantageous properties such as strength, lightness, corrosion resistance, recyclability and formability, aluminum is being employed in an ever-increasing number of applications. The methods and teachings of the present disclosure provide one such application for which aluminum allows 6061, or 6061 with T1 or T2 thermal stress treatments may be desirable for both vibration reduction and weight bearing.

Referring to FIGS. 11 through 15, perforated metal can be cut to different sizes. Due to differences in table/platform with legs, the tool pedestal/pad is sitting on waffle floor in the process level. The following figures show how the present teachings address the requirement of platforms to be formed in different configurations. Accordingly, modifications to perforated metal designs include the placement of sound dampening caulk in the voided spaces and sandwiching or by any other means are considered within the teachings of the present disclosure. Perforated metals with different size voids (overlapping between the metal layers) filled with sound dampening adhesive caulk (creating hybrid vibration dampening/isolation barrier), may be layered with up to vibration dampening or isolation, as needed, and be well within the present scope. That is, high strength porous metal may be on top or bottom or middle or any combination thereof. Examples of such configurations now follow.

FIG. 13 is 3-D view of concrete encased in metal type tool pedestal/pad 226 and layered hybrid dampener) multiple perforated spacers 222 with soundproofing/dampening adhesive/caulk and simple hybrid dampener) perforated spacer 224 with soundproofing/dampening adhesive/caulk at point of contact, set in clean room with waffle floor.

FIG. 14 is 3-D view of examples 230, including examples 232, 234, and 236, of high strength porous metal with voided spaces filled with soundproofing/dampening adhesive/caulk in voided area. Both the size of void spaces, pattern and thickness varies for type of applications wherein such porous metals may be used for the desired vibration isolation.

FIG. 15 is 3-D view of examples 240, including examples 242, 244, and 246 of multiple layered hybrid dampener layers of perforated high strength porous metal filled with soundproofing/dampening adhesive/caulk in voided area. Note that the size, shape of void spaces, pattern and thickness may vary for different types of applications.

Perforated metal spacers formed from materials such as examples 240 may be made from high strength porous metal, including aluminum alloy 6061, or 6062 T1 or T2 heat treated aluminum. With such materials, void spaces may be filled with sound dampening acoustical adhesive/caulk. If needed, metal spacers may be double layered with different size openings to over lap the bottom or other plate for better combined exposure to better sound dampening material (acoustical adhesive/caulk). And since it is the perforated high strength metal, it can be tightened down. Also material to include the metal is non corrosive with negative ion properties.

An important aspect of the present disclosure includes the use of a rubbery material with sound dampening characteristics. However, a rubbery gasket alone provides an insufficient design. The rubber gasket is insufficient because of the movement and compressibility associated with pure rubber or elastic material. Movement and compressibility is unacceptable for semiconductor production, because movement affects lithographic accuracy and deposition alignment. Instead, the present disclosure provides the vibration isolation aspect of a rubbery or elastic material, as well as the necessary strength and lack or movement/compressibility. High strength porous metal finds attractive use in the subject disclosure, because it avoids compressibility. Moreover, by filling void spaces areas with sound dampening materials certain advantages arise. The present subject matter makes novel use of different sized perforated spacings. As such, overlapping voided spaces prevent metal-on-metal contact. Preventing metal-on-metal contact avoids or substantially reduces any possible direct vibration conduction path. The result becomes a marked improvement in vibration isolation for even the most delicate semiconductor device processes.

The present disclosure provides a fundamentally different type of anti vibration pad from ones within the prior art. All anti vibration pads are compressible, semi rigged (firm to certain point and/or expensive active controlled) which is not cost feasible for the whole FAB. The vibration isolation pad of the present disclosure provides a different design.

To explain the difference, consider FIG. 16, which shows different vibration isolation standards for different environments. FIG. 16 shows plot 250 of Velocity Levels in dB re 1 μ-in/s against One-Third Octave Band Center Frequency (Hz) for various vibration standards. Thus, Workshop (ISO) standard 252 ranging from 8 Hz to 80 Hz at a level of 90 dB re 1 μ-in/s. Other standards include Office (ISO) level 254, Residential Day (ISO) standard 256, Op. Theatre (ISO) 258, and then standards VC-A 260, VC-B 262, VC-C 264, VC-D 266, and VC-E 268. Note that standard VC-E 268 is the most stringent requirement, at 3 μm/s, 123, 125 μ-in/s, and 42 dB.

For most semiconductor fabrication facility applications, such as 14 nm and 10 nm facilities, specifying the VC-D 266 level of vibration isolation is sufficient. However, for production critical tools, industry standards are likely to be at the VC-E 268 level, in the future. However, no fully populated FAB presently meets the VC-E 268 standard. For 7 nm, 5 nm & 3 nm standard, VC-E 268 may be demanded facility-wide or at least in critical areas. Accordingly, the present teachings provide the ability to minimize/reduce or isolate vibration, much as possible, but with time and cost effectiveness.

On the vibration question, VC-D 266 provides a satisfactory starting point for the semiconductor processing equipment fabrication vibration regime. Due to small nanometer critical dimension process requirements, the semiconductor industry may soon demand specifying VC-E 268. Unfortunately, no fully populated fabrication facility meets such a requirement. Some manufacturers may even extend their criteria up to 250 Hz, but typically the lower frequencies are more detrimental to fabrication processes. According, the present disclosure provides a highly practical, valuable, and extraordinarily effective way to satisfy both current and future vibration reduction/elimination requirements.

In summary, the present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure. The method comprises the steps of separating a base of the elevated structure from the floor using a first vibration isolation pad structure. A vibration absorbing foam fills a hollow portion of a vertical support structure separating the base from said upper surface. A second vibration isolation pad structure separates the vertical support structure from the upper structure of the elevated structure. In the present disclosure, the first vibration isolation pad structure, the vibration absorbing foam, and the second isolation pad structure coordinate to eliminate or substantially reduce the ability of vibrations from the floor to reach high-precision device manufacturing equipment operating on the upper surface of said elevated structure.

Technical advantages of the present disclosure include providing a hybrid system for eliminating/substantially reducing both high frequency vibrations and low frequency vibrations. High frequency vibrations may be considered, for example, Workshop (ISO), Office (ISO), Residential Day (ISO), and Operating Theatre (ISO) ranges of vibration, as defined here by the chart of FIG. 16. Low frequency vibrations may be considered those vibrations classified as VC-C, VC-D, and VC-E in FIG. 16. The teachings of the present disclosure provide the ability to establish an environment operating in the range of VC-E.

The disclosed method and system include the use of dedicated MEP (mechanical, electrical, plumbing) support pedestals, only attach as support for MEP lines, as to improve isolation of low frequency vibration. With minimal weight increased for material for ease of material handling and installation, this method is intended for tools without specifically vibration frequency dampened and isolation designed tool pedestals and pads; which only relied on it's built in passive vibration isolation systems. Reduction and isolation of vibration frequencies for improving production yields as semiconductor chip design is advancing in smaller nanometer critical dimensions for semiconductor device processing.

The disclosed vibration isolation structures in addition to industry standard structures such as construction isolation joints, miniature damping pads between raised floor tiles to pedestal, and vibration isolation connectors for MEP lines. Moreover, the improved isolation of vibration frequencies transmitted though building structure to achieve better production yield rates.

The method and system of the present disclosure are economical, schedule driven and impose minimal weight in the construction of material handling and installation facilities for nanometer-scale semiconductor fabrication facilities and similar high precision lithography and fabrication environments. As a result of the present teachings, semiconductor fabrication yields and process efficiencies greatly improve.

The present method and system eliminate or substantially reducing low frequency vibrations which affect production tools such as lithograph tools, so as to increase lithographic accuracy and yield percentages in semiconductor device fabrication. Accordingly, the effects from vibration sources, such as foot traffic over raised floor system, pumps, compressors, chillers and AHUs (air handling units) that produce low vibration frequencies transmitted though building and clean room floor structures.

The present disclosure includes the ability to allow newer semiconductor production tools having tighter vibration frequency requirements to operate effectively in conjunction with older support tools with outdated vibration specifications. The ability to extend older equipment useful live may result in process expense reductions and greater operational profits for semiconductor device fabrication facilities. The disclosed design permits vibration isolation without having to modify entire structures, as well as with minimal overall weight variations as a result of vibration isolation modifications.

The present disclosure permits installation of composite foam within structural components rapidly and as little as one-day disruption in fabrication facility operations. As a result, the significant improvements of the present subject matter afford major operational and efficiency improvements with a most economical set of structural transformations to increase overall fabrication facility profitability and efficiency. The disclosed subject matter avoids the enormous expense of replacing all old support tools with new ones having vibration specification matching new key production tools.

The detailed description set forth herein in connection with the appended drawings is intended as a description of exemplary embodiments in which the presently disclosed subject matter may be practiced. The term “exemplary” used throughout this description means “serving as an example, instance, or illustration,” and should not necessarily be construed as preferred or advantageous over other embodiments.

This detailed description of illustrative embodiments includes specific details for providing a thorough understanding of the presently disclosed subject matter. However, it will be apparent to those skilled in the art that the presently disclosed subject matter may be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the presently disclosed method and system.

The foregoing description of embodiments is provided to enable any person skilled in the art to make and use the subject matter. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the novel principles and subject matter disclosed herein may be applied to other embodiments without the use of the innovative faculty. The claimed subject matter set forth in the claims is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. It is contemplated that additional embodiments are within the spirit and true scope of the disclosed subject matter. 

What is claimed is:
 1. A method for eliminating or substantially reducing process-inhibiting vibrations within a high-precision semiconductor device fabrication facility, comprising the steps of: supporting a high-precision semiconductor device fabrication equipment on a hybrid tool pedestal system within a building that may be exposed to and susceptible to transmitting process inhibiting vibrations to said high-precision semiconductor device fabrication equipment, wherein said hybrid tool pedestal system comprises a multi-layered material construction formed of materials selected for isolating varying vibration frequencies by virtue of the combined isolation of said multi-layered material construction; positioning said hybrid tool pedestal system on a raised floor, said raised floor for structurally separating a building floor from said hybrid tool pedestal system for providing a first portion of vibration isolation between the high-precision semiconductor device fabrication equipment and the building floor, said hybrid tool pedestal system comprising a plurality of base structures for positioning said hybrid tool pedestal system on said raised floor and an elevated structure for providing structural support and separating a high-precision semiconductor device fabrication equipment positioned on said elevated structure from said plurality of base structures; separating said plurality of base structures from said raised floor using a plurality of first vibration isolation pads, said plurality of first vibration isolation pads comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking; positioning a plurality of first vertical support structures as a portion of said elevated structure and separating an upper structure of said elevated structure from at least selected ones of said plurality of base structures, said selected ones of said plurality of first vertical support structures further comprising a hollow portion capable of being filled; filling at least a subset of said hollow portions with a vibration absorbing foam for absorbing vibrations transmitted to said first vertical support structures; separating said plurality of first vertical support structures from said upper structure using a second vibration isolation pad comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking; wherein said first vibration isolation pads, said vibration absorbing foam, and said second vibration isolation pad coordinate to eliminate or substantially reduce the ability of vibrations from the building floor to reach high-precision semiconductor device fabrication equipment operating on said upper surface of said elevated structure; and further separating said second isolation pad from said upper structure using a vertical structural beam, said vertical structural beam connecting to said upper structure at a first joint and to said second isolation pad at a second joint; and applying a vibration frequency isolation structure in the form of either an adhesive pad, caulking, or a combination of adhesive pad and caulking at said first joint for vibration isolating said upper structure from said vertical structural beam and at said second joint for vibration isolating said vertical structural beam from said second isolation pad for further preventing vibration isolating said semiconductor device fabrication process inhibiting vibrations at the building floor from affecting precision operation of the high-precision semiconductor device fabrication equipment on said upper structure.
 2. The method of claim 1, further comprising the step of eliminating/substantially reducing both high frequency vibrations of approximately ranging from approximately 100 μm/s to approximately 800 μm/s and low frequency vibrations approximately ranging from approximately 3 μm/s to approximately 50 μm/s for preventing said high frequency vibrations from inhibiting high-precision semiconductor device fabrication equipment operations.
 3. The method of claim 1, further comprising the step of isolating vibrations associated with MEP lines using a plurality of vibration isolation pedestal configurations to improve isolation of vibrations frequency transmitted by MEP lines and connecting though the building floor.
 4. A system for eliminating or substantially reducing process-inhibiting vibrations within a high-precision semiconductor device fabrication facility, comprising: a hybrid tool pedestal system supporting a high-precision semiconductor device fabrication equipment within a building exposed to and susceptible to transmitting process limiting vibrations; said hybrid tool pedestal system positioned on a raised floor, said raised floor for being structurally separated from a building floor for providing a first portion of vibration isolation between the high-precision semiconductor device fabrication equipment and the building floor, said hybrid tool pedestal system comprising a plurality of base structures for positioning said hybrid tool pedestal system on said raised floor and an elevated structure for providing structural support and separating a high-precision semiconductor device fabrication equipment positioned on said elevated structure from said plurality of base structures; a plurality of first vibration isolation pads for separating said plurality of base structures from said raised floor using, said plurality of first vibration isolation pads comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking; a plurality of first vertical support structures positioned as a portion of said elevated structure and separating an upper structure of said elevated structure from at least selected ones of said plurality of base structures, said selected ones of said plurality of first vertical support structures further comprising a hollow portion capable of being filled; a vibration absorbing foam filling at least a subset of said hollow portions with for absorbing vibrations transmitted to said first vertical support structures; a second vibration isolation pad comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking separating said plurality of first vertical support structures from said upper structure; wherein said first vibration isolation pads, said vibration absorbing foam, and said second vibration isolation pad coordinate to eliminate or substantially reduce the ability of vibrations from the building floor to reach high-precision semiconductor device fabrication equipment operating on said upper surface of said elevated structure; and a vertical structural beam further separating said second isolation pad from said upper structure using, said vertical structural beam connecting to said upper structure at a first joint and to said second isolation pad at a second joint; and a vibration frequency isolation structure in the form of either an adhesive pad, caulking, or a combination of adhesive pad and caulking at said first joint for vibration isolating said upper structure from said vertical structural beam and at said second joint for vibration isolating said vertical structural beam from said second isolation pad for further preventing vibration isolating said semiconductor device fabrication process inhibiting vibrations at the building floor from affecting precision operation of the high-precision semiconductor device fabrication equipment on said upper structure.
 5. The system of claim 4, wherein said first vibration isolation pad structure, said vibration absorbing foam, and said second isolation pad structure eliminate/substantially reduce both high frequency vibrations of approximately ranging from approximately 100 pm/s to approximately 800 pm/s and low frequency vibrations approximately ranging from approximately 3 pm/s to approximately 50 pm/s for preventing said high frequency vibrations from inhibiting high-precision semiconductor device fabrication equipment operations.
 6. The system of claim 4, further comprising a plurality of vibration isolation pedestal configurations for isolating vibrations associated transmitted by MEP lines using to improve isolation of vibrations frequency transmitted MEP lines and connecting though the building floor.
 7. A high-precision semiconductor device fabrication facility having eliminated or substantially reduced process-limiting vibrations there within, comprising: a high-precision semiconductor device fabrication facility comprising a building having a building floor, wherein said building may be exposed to and susceptible to transmitting process-inhibiting vibrations; a hybrid tool pedestal system supporting a high-precision semiconductor device fabrication equipment; said hybrid tool pedestal system on a raised floor, said raised floor for being structurally separated from the building floor for providing a first portion of vibration isolation between the high-precision semiconductor device fabrication equipment and the building floor, said hybrid tool pedestal system comprising a plurality of base structures for positioning said hybrid tool pedestal system on said raised floor and an elevated structure for providing structural support and separating a high-precision semiconductor device fabrication equipment positioned on said elevated structure from said plurality of base structures; a plurality of first vibration isolation pads, separating said plurality of base structures from said raised floor, said plurality of first vibration isolation pads comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking; a plurality of first vertical support structures positioned as a portion of said elevated structure and separating an upper structure of said elevated structure from at least selected ones of said plurality of base structures, said selected ones of said plurality of first vertical support structures further comprising a hollow portion capable of being filled; a vibration absorbing foam filling at least a subset of said hollow portions for absorbing vibrations transmitted to said first vertical support structures; a second vibration isolation pad comprising an adhesive pad, caulking, or a combination of adhesive pads and caulking for separating said plurality of first vertical support structures from said upper structure; wherein said first vibration isolation pads, said vibration absorbing foam, and said second vibration isolation pad coordinate to eliminate or substantially reduce the ability of vibrations from the building floor to reach high-precision semiconductor device fabrication equipment operating on said upper surface of said elevated structure; and a vertical structural beam further separating said second isolation pad from said upper structure, said vertical structural beam connecting to said upper structure at a first joint and to said second isolation pad at a second joint; and vibration frequency isolation structure in the form of either an adhesive pad, caulking, or a combination of adhesive pad and caulking at said first joint for vibration isolating said upper structure from said vertical structural beam and at said second joint for vibration isolating said vertical structural beam from said second isolation pad for further preventing vibration isolating said semiconductor device fabrication process inhibiting vibrations at the building floor from affecting precision operation of the high-precision semiconductor device fabrication equipment on said upper structure.
 8. The high-precision device manufacturing facility of claim 7, wherein said first vibration isolation pad structure, said vibration absorbing foam, and said second isolation pad structure eliminate/substantially reduce both high frequency vibrations of approximately ranging from approximately 100 μm/s to approximately 800 μm/s and low frequency vibrations approximately ranging from approximately 3 μm/s to approximately 50 μm/s for preventing said high frequency vibrations from inhibiting high-precision semiconductor device fabrication equipment operations.
 9. The high-precision device manufacturing facility of claim 7, further comprising a plurality of vibration isolation pedestal configurations for isolating vibrations transmitted by MEP lines and connecting though the building floor. 